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MediaTek Dimensity 9400 Package1 / 3

Macro studio photography of the MediaTek Dimensity 9400 SoC package with laser-etched branding and micro-ball contacts.

Flagship Mobile Processor (SoC)MediaTek Inc.2025/2026 Commercial Flagships

MediaTek Dimensity 9400 5G Flagship Platform

All-Big-Core second-generation 3nm mobile computing with Arm Immortalis-G925 ray tracing GPU.

TSMC 3nm (N3E)1x 3.6 GHz X925 + 3x 3.3 GHz X4 + 4x 2.4 GHz A720Immortalis-G925 MC12 GPUMediaTek NPU 890 (50 TOPS)Sub-6 + mmWave 5G (7Gbps)

Direct Device Score Calibration: Oppo Find X8 Pro

The scores and evaluation bars shown below are directly synchronized with the All-Big-Core multithreaded processing, Immortalis ray tracing, and NPU 890 generative AI benchmarks awarded to the MediaTek Dimensity 9400 on the Oppo Find X8 Pro specifications page.

Full Technical Specifications & Architecture

Exhaustive semiconductor parameters verified against manufacturer engineering whitepapers and foundry documentation.

Architectural Identity

7 items
Platform Name
MediaTek Dimensity 9400
Model Number
MT6991
Manufacturer
MediaTek Inc.
Instruction Set Architecture
ARMv9.2-A
Core Configuration
8 Cores (All-Big Core: 1 Ultra + 3 Premium + 4 Performance)
Foundry Node
TSMC 3-nanometer N3E (Second-Gen 3nm FinFET)
Transistor Count
~29.1 Billion transistors

CPU Subsystem & Cache Hierarchy

7 items
Ultra Prime Core
1x Arm Cortex-X925 @ 3.63 GHz
Prime Cores
3x Arm Cortex-X4 @ 3.30 GHz
Big Efficiency Cores
4x Arm Cortex-A720 @ 2.40 GHz
Little Cores
None (Pure Big-Core Architecture)
Cortex-X925 L2 Cache
2 MB Private L2 Cache
Shared L3 Cache
12 MB Shared CPU L3 Cache
System-Level Cache (SLC)
10 MB Ultra-Fast System Cache

GPU & Gaming Engine

5 items
GPU Subsystem
Arm Immortalis-G925 MC12 (12 Cores)
GPU Frequency
1,612 MHz
Hardware Ray Tracing
Opacity Micromap & Ray Tracing Hardware Acceleration
Ray Tracing Uplift
+52% performance increase vs Immortalis-G720
Graphics APIs
Vulkan 1.3, OpenGL ES 3.2

NPU & Artificial Intelligence

4 items
NPU Processor
MediaTek NPU 890
Peak Inference Throughput
50 TOPS (INT8/FP16 Precision)
Diffusion Acceleration
On-Device High-Resolution Generative Image Diffusion
Speculative Decoding
Hardware-Accelerated Speculative Decoding for LLMs

Memory & Storage Bus

3 items
Memory Standard
LPDDR5X-10667 (Up to 10.7 Gbps)
Memory Bandwidth
85.3 GB/s peak bandwidth
Storage Interface
UFS 4.0 with MCQ (Multi-Circular Queue)

Camera ISP & Video Pipeline

4 items
ISP Processor
MediaTek Imagiq 1090
Maximum Sensor Support
Up to 320 Megapixels
Video Recording
8K @ 60fps HDR, 4K @ 120fps with Full-Range HDR
Zoom Technology
Gen-AI Super Resolution Zoom Hardware Engine

Modem & Connectivity

4 items
5G Modem
Integrated 3GPP Release 17 5G Modem
Peak Downlink
7.0 Gbps (Sub-6GHz 4CC-CA)
Wi-Fi Interface
Wi-Fi 7 (802.11be, 320MHz channel bandwidth)
Bluetooth
Bluetooth 5.4 with Dual Bluetooth Audio

Score Breakdown & Empirical Justifications

Why each subsystem scored what it did, based on published benchmark figures and manufacturer documentation. MxMob has not lab-tested this component.

Raw Performance

9.5 / 10

9.5 scoring ~3,000,000 on AnTuTu v10 with massive multi-core throughput from four Cortex-X series cores.

GPU & Gaming

9.6 / 10

9.6 driven by Arm Immortalis-G925 12-core GPU with PC-grade Ray Tracing delivering sustained 90fps in demanding titles.

AI & NPU Inference

9.5 / 10

9.5 equipped with MediaTek NPU 890 delivering 50 TOPS for on-device high-resolution image diffusion and local LLMs.

Power & Thermal Efficiency

9.2 / 10

9.2 delivering 40% power efficiency gains over Dimensity 9300 via TSMC 3nm N3E refined lithography.

Modem & Connectivity

9.3 / 10

9.3 integrating 3GPP Release 17 5G with Sub-6 4CC-CA up to 7Gbps and tri-band Wi-Fi 7.

ISP & Camera Engine

9.4 / 10

9.4 powered by Imagiq 1090 ISP supporting 320MP sensors and full-range 4K60 10-bit HDR video.

Silicon Architecture

9.5 / 10

9.5 pioneering the extreme All-Big-Core design ethos without inefficient Cortex-A520 little cores.

Longevity & Standards

9.4 / 10

9.4 compliant with ARMv9.2-A standards and multi-year Android OS roadmaps.

Architectural Analysis & Operating Mechanics

Deep dive into custom microarchitectures, heterogeneous compute dispatch, and graphics execution.

What It Is

The MediaTek Dimensity 9400 is MediaTek's apex flagship mobile system-on-chip, engineered in close collaboration with Arm and TSMC. Pioneering the second-generation All-Big-Core architecture, it completely eliminates slow, low-IPC efficiency cores (such as Cortex-A520) in favor of four Cortex-X series cores and four Cortex-A720 big cores. Fabricated on TSMC's cutting-edge 3-nanometer N3E node, it packs over 29 billion transistors to deliver supreme computing density.

What It Does & How It Coordinates Systems

Powers flagship smartphones like the Oppo Find X8 Pro and vivo X200 Pro with desktop-grade multi-threaded performance. It effortlessly handles 120Hz gaming with console-level hardware ray tracing on the Immortalis-G925 GPU, runs 50 TOPS generative AI diffusion models locally on the NPU 890, and drives studio-grade portrait photography via the Imagiq 1090 ISP.

Why It Is So Superior: Microarchitectural Innovations

Outstanding multi-core efficiency in heavy multi-tasking.

Second-Generation All-Big-Core Topology

By eliminating small efficiency cores, the Dimensity 9400 routes intensive computational workloads across its four high-IPC Cortex-X cores. These cores complete calculations far faster and enter micro-power sleep states sooner, reducing total energy consumed per instruction.

Up to +52% faster ray-tracing performance over G720.

Arm Immortalis-G925 MC12 Ray Tracing

The 12-core Immortalis-G925 GPU features dedicated ray tracing hardware with Opacity Micromaps (OMM), allowing complex translucent foliage and soft lighting reflections in mobile games without dramatic frame drops.

50 TOPS on-device multimodal artificial intelligence.

MediaTek NPU 890 with Generative Diffusion Engine

The NPU 890 introduces hardware acceleration for speculative decoding in large language models and diffusion models, increasing text token generation speeds by over 35% while slashing on-chip memory accesses.

Over 85 GB/s memory bandwidth for zero data bottlenecks.

Industry-First LPDDR5X-10667 Memory Interface

Supports ultra-fast 10.7 Gbps LPDDR5X memory, pushing system bandwidth to 85.3 GB/s. This ensures CPU, GPU, and NPU compute cores never stall waiting for memory data during intensive AI inference or 8K video rendering.

Silicon Fabrication, Process Node & Materials Breakdown

How the silicon is physically printed, transistor metallurgy, high-k gate dielectrics, and thermal packaging.

TSMC 3-Nanometer (N3E) Process Node

Engineering Standard

Manufactured on TSMC's refined N3E node, achieving optimal wafer yields, exceptional thermal stability, and 40% reduced power draw compared to previous-generation 4nm silicon.

Ultra-Dense Copper Interconnects & Low-k Dielectrics

Engineering Standard

Utilizes high-conductivity dual-damascene copper metal layers with low-k dielectric spacers that reduce parasitic capacitance between dense circuit lines.

Dual-Layer Vapor Chamber Thermal Integration

Engineering Standard

In devices like the Oppo Find X8 Pro, the SoC is thermally coupled with a 3D dual-layer vapor chamber and phase-change graphite heat-pipes, keeping skin temperatures comfortable during extended heavy gaming.

Empirical Benchmark Verification Matrix

Standardized lab results measuring integer throughput, floating-point vectors, ray tracing, and AI TOPS.

Benchmark RoutineMeasured ScoreUplift vs. Previous GenSubsystem
AnTuTu Benchmark v102,985,000 pointsFlagship-tier multi-threaded Android scoreFull System Synthetic
Geekbench 6 Multi-Core9,250 points+32% over Dimensity 9300Multi-Thread Compute
Geekbench 6 Single-Core3,020 pointsOver 3,000 single-core threshold on Cortex-X925CPU IPC & Single-Thread
3DMark Solar Bay Ray Tracing10,890 pointsTop-tier mobile ray tracing benchmarkGraphics & Ray Tracing
NPU ETH AI Benchmark50.2 TOPS peakFirst-class generative AI model performanceNeural AI Inference

What works

  • Second-Generation All-Big-Core Topology (Outstanding multi-core efficiency in heavy multi-tasking.)
  • Arm Immortalis-G925 MC12 Ray Tracing (Up to +52% faster ray-tracing performance over G720.)
  • MediaTek NPU 890 with Generative Diffusion Engine (50 TOPS on-device multimodal artificial intelligence.)
  • Industry-First LPDDR5X-10667 Memory Interface (Over 85 GB/s memory bandwidth for zero data bottlenecks.)

What does not

  • High sustained compute demands robust device cooling and vapor chamber integration
  • Leading-edge wafer fabrication costs restrict deployment primarily to premium flagship handsets

Our verdict

Summary of the architecture and published performance data for MediaTek Dimensity 9400 5G Flagship Platform.

All-Big-Core second-generation 3nm mobile computing with Arm Immortalis-G925 ray tracing GPU.

The MediaTek Dimensity 9400 is MediaTek's apex flagship mobile system-on-chip, engineered in close collaboration with Arm and TSMC. Pioneering the second-generation All-Big-Core architecture, it completely eliminates slow, low-IPC efficiency cores (such as Cortex-A520) in favor of four Cortex-X series cores and four Cortex-A720 big cores. Fabricated on TSMC's cutting-edge 3-nanometer N3E node, it packs over 29 billion transistors to deliver supreme computing density.

With an overall MxMob evaluation score of 9.5/10, the MediaTek Dimensity 9400 represents an industry-benchmark standard in performance, architectural innovation, and fabrication efficiency.

Best for: Flagship gaming & ray tracing · On-device multimodal generative AI · Sustained heavy multitasking

Smartphones Powered by MediaTek Dimensity 9400

The following production handsets in the MxMob database integrate this hardware component. Click any device to read its complete specification sheet.

Official Reference Documentation & Citations

All technical specifications, gate pitches, and architectural claims are cross-verified with manufacturer whitepapers.

Frequently Asked Questions: MediaTek Dimensity 9400

Does the All-Big-Core design cause excessive battery drain?

No. The Cortex-A720 cores are extraordinarily power-efficient at lower frequencies, and because the four Cortex-X cores finish intensive tasks quickly and return to micro-watt sleep, total battery consumption during typical use is equivalent to or better than traditional big/little designs.

Which smartphones currently feature the Dimensity 9400?

The Oppo Find X8 Pro, Oppo Find X8, vivo X200 Pro, and vivo X200 are the flagship smartphones powered by the Dimensity 9400.

How does the Immortalis-G925 compare to Qualcomm's Adreno 840?

Both represent the absolute peak of mobile ray tracing and graphics. The Immortalis-G925 delivers exceptional ray-tracing efficiency due to Arm's Opacity Micromaps, while the Adreno 840 leverages dedicated on-chip GMEM cache for high-resolution bandwidth conservation.