Flagship Mobile Processor (SoC)Silicon9.8Qualcomm Technologies, Inc.·October 2025
Snapdragon 8 Elite Gen 5
TSMC 3nm (N3P) FinFET · 2x 4.5 GHz + 6x 3.5 GHz Oryon · Adreno 840 GPU (1350 MHz)
Smartphones are more than marketing names on a box. Explore isolated deep evaluations of mobile processors, custom CPU microarchitectures, 1-inch stacked camera sensors, and silicon-carbon battery chemistries powering modern devices.
The pinnacle 3nm custom Oryon mobile platform orchestrating 2026 apex Android computing. Engineered with second-generation custom Qualcomm Oryon Phoenix CPU cores clocked up to 4.50 GHz, a sliced-architecture Adreno 840 GPU with dedicated GMEM cache, and an 80+ TOPS Hexagon NPU. Built on TSMC second-generation 3nm FinFET (N3P) lithography.
Click on any hardware component to inspect full technical specifications, score bars, and powered smartphones.
Traditional smartphone benchmarks can be heavily distorted by vendor aggressive throttling profiles, room temperatures, or synthetic cheat triggers. MxMob isolates individual component capability:
We evaluate decoder execution width, branch prediction accuracy, unified L2/L3 cache sizes, and memory bus throughput directly from semiconductor foundry disclosures.
From High-NA EUV optical tolerances to hafnium high-k metal gate dielectric barriers and ruthenium liners, we document the physical chemistry that stops electron leakage.
Every score wired into a device page (such as Performance and Gaming ratings on the Galaxy S26 Ultra) is directly linked back to its underlying hardware component breakdown.
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