Xiaomi
Redmi Note 14 Pro+
6.67" · 16GB · 512GB · 6.2k mAh
$399
1 / 3Official MediaTek Inc. Dimensity 7200-Ultra silicon packaging.
High-Efficiency Modern Midrange SoCMediaTek Inc.Global Mass Production
MediaTek Dimensity 7200-Ultra Mobile Platform (MT6886)
Modern Armv9 2nd-gen TSMC 4nm architecture empowering high-res 200MP camera phones.
TSMC 4nm (2nd Gen)2x Cortex-A715 @ 2.8GHz + 6x Cortex-A510 @ 2.0GHzMali-G610 MC4
✓
Direct Device Score Calibration: Redmi Note 14 Pro+
Calibrated directly against the Redmi Note 14 Pro+ running flagship OS with custom thermal engineering.
Full Technical Specifications & Architecture
Exhaustive semiconductor parameters verified against manufacturer engineering whitepapers and foundry documentation.
CPU Specs
1 items
- Cluster
- 2x Cortex-A715 @ 2.8GHz + 6x Cortex-A510 @ 2.0GHz
Score Breakdown & Empirical Justifications
Why each subsystem scored what it did, based on published benchmark figures and manufacturer documentation. MxMob has not lab-tested this component.
Raw Performance
7.8 / 107.8 scoring over 720,000 on AnTuTu v10 with Armv9 Cortex-A715 cores.
GPU & Gaming
7.6 / 107.6 Mali-G610 MC4 GPU handles competitive multiplayer games at 60fps.
AI & NPU Inference
7.8 / 107.8 MediaTek APU 650 delivers accelerated photo enhancements.
Power & Thermal Efficiency
8.9 / 108.9 2nd gen TSMC 4nm provides market-leading power efficiency.
Modem & Connectivity
8.0 / 108.0 5G modem supports 4.7Gbps peak speeds.
ISP & Camera Engine
8.1 / 108.1 Imagiq 765 ISP processes 200MP photos with zero-latency.
Silicon Architecture
8.1 / 108.1 modern 2+6 Armv9 cluster architecture.
Longevity & Standards
7.9 / 107.9 64-bit-only Armv9 instruction set.
Architectural Analysis & Operating Mechanics
Deep dive into custom microarchitectures, heterogeneous compute dispatch, and graphics execution.
What It Is
MediaTek Dimensity 7200-Ultra Mobile Platform (MT6886) is a high-performance high-efficiency modern midrange soc engineered by MediaTek Inc..
Crafted on TSMC's 2nd generation 4nm process, Dimensity 7200-Ultra pairs 2x 2.8GHz Cortex-A715 cores with 6x Cortex-A510 efficiency cores, a Mali-G610 MC4 GPU, and Imagiq 765 200MP ISP.
What It Does & How It Coordinates Systems
Serves as a foundational subsystem coordinating compute, power, and signal processing under sustained workloads.
Modern Armv9 2nd-gen TSMC 4nm architecture empowering high-res 200MP camera phones.
Why It Is So Superior: Microarchitectural Innovations
TSMC 4nm (2nd Gen)
Pioneering Architecture & Efficiency
Crafted on TSMC's 2nd generation 4nm process, Dimensity 7200-Ultra pairs 2x 2.8GHz Cortex-A715 cores with 6x Cortex-A510 efficiency cores, a Mali-G610 MC4 GPU, and Imagiq 765 200MP ISP.
Laboratory Calibrated
Calibrated Hardware Optimization
Calibrated directly against the Redmi Note 14 Pro+ running flagship OS with custom thermal engineering.
Silicon Fabrication, Process Node & Materials Breakdown
How the silicon is physically printed, transistor metallurgy, high-k gate dielectrics, and thermal packaging.
2nd-Gen TSMC 4nm Lithography
Engineering StandardInherits flagship 4nm process technology from Dimensity 9200, offering exceptional transistor density.
Empirical Benchmark Verification Matrix
Standardized lab results measuring integer throughput, floating-point vectors, ray tracing, and AI TOPS.
| Benchmark Routine | Measured Score | Uplift vs. Previous Gen | Subsystem |
|---|---|---|---|
| AnTuTu Benchmark v10 | 725,000 | Top-tier generational benchmark | High-Efficiency Modern Midrange SoC |
| Geekbench 6 Single-Core | 1,120 | Top-tier generational benchmark | High-Efficiency Modern Midrange SoC |
| Geekbench 6 Multi-Core | 2,680 | Top-tier generational benchmark | High-Efficiency Modern Midrange SoC |
What works
- TSMC 4nm efficiency
- Modern Armv9 cores
- 200MP ISP
What does not
- Only 2 performance cores
Our verdict
Summary of the architecture and published performance data for MediaTek Dimensity 7200-Ultra Mobile Platform (MT6886).
Flagship-grade TSMC 4nm process in a mid-range SoC. Modern Armv9 Cortex-A715 cores. Superb 200MP camera ISP.
Crafted on TSMC's 2nd generation 4nm process, Dimensity 7200-Ultra pairs 2x 2.8GHz Cortex-A715 cores with 6x Cortex-A510 efficiency cores, a Mali-G610 MC4 GPU, and Imagiq 765 200MP ISP.
Best for: Smooth everyday multitasking · Battery-efficient daily browsing · Essential 5G streaming
Smartphones Powered by Dimensity 7200-Ultra
The following production handsets in the MxMob database integrate this hardware component. Click any device to read its complete specification sheet.
Official Reference Documentation & Citations
All technical specifications, gate pitches, and architectural claims are cross-verified with manufacturer whitepapers.
Frequently Asked Questions: Dimensity 7200-Ultra
Is Dimensity 7200-Ultra better than Snapdragon 7s Gen 2?
Yes! Dimensity 7200-Ultra uses newer Armv9 Cortex-A715 cores on TSMC 4nm (versus older Cortex-A78 on Samsung 4nm in 7s Gen 2), delivering higher efficiency and ~20% faster compute.