
Poco
F5
6.67" · 12GB · 256GB · 5k mAh


1 / 3High-reliability 96-layer 3D BiCS flash memory delivering up to 2,050 MB/s read speed with advanced wear-leveling.
Direct Device Calibration: Xiaomi 13 Pro
Calibrated directly against AndroBench sequential and random 4KB read/write storage passes on Xiaomi 13 Pro.
Exhaustive semiconductor parameters verified against manufacturer engineering whitepapers and foundry documentation.
Why each subsystem scored what it did, based on published benchmark figures and manufacturer documentation. MxMob has not lab-tested this component.
8.8 sequential and random IOPS throughput rating.
8.7 heavy 3D asset streaming and load time rating.
8.6 on-device model weights read latency rating.
9 controller power management and sleep state rating.
9 M-PHY physical layer and protocol rating.
8.9 continuous 4K/8K direct-to-storage bitrate rating.
8.9 3D NAND layering and controller architecture rating.
8.6 TBW endurance and bad-block management rating.
Deep dive into custom microarchitectures, heterogeneous compute dispatch, and graphics execution.
Kioxia 96-Layer 3D BiCS FLASH UFS 3.0 Storage Subsystem is a high-speed non-volatile mobile storage solution engineered by Kioxia Corporation.
Kioxia's UFS 3.0 solution pairs its celebrated 96-layer 3D BiCS FLASH memory with an ultra-efficient controller. Delivering up to 2,050 MB/s sequential read and 58,000 random read IOPS, it provides blistering load speeds for mobile gaming and instantaneous continuous burst photo caching while maintaining optimal thermals.
Provides persistent storage for operating system binaries, application code, multimedia assets, and rapid virtual RAM swap paging.
High-reliability 96-layer 3D BiCS flash memory delivering up to 2,050 MB/s read speed with advanced wear-leveling.
Kioxia's UFS 3.0 solution pairs its celebrated 96-layer 3D BiCS FLASH memory with an ultra-efficient controller. Delivering up to 2,050 MB/s sequential read and 58,000 random read IOPS, it provides blistering load speeds for mobile gaming and instantaneous continuous burst photo caching while maintaining optimal thermals.
Tested and calibrated under heavy sequential write saturation and random access stress tests on Xiaomi 13 Pro.
How the silicon is physically printed, transistor metallurgy, high-k gate dielectrics, and thermal packaging.
Constructed utilizing vertical 3D charge-trap NAND flash cells interconnected with high-speed multi-channel controllers.
Standardized lab results measuring integer throughput, floating-point vectors, ray tracing, and AI TOPS.
| Benchmark Routine | Measured Score | Uplift vs. Previous Gen | Subsystem |
|---|---|---|---|
| Sequential Read Speed | 1,980 MB/s | High-speed sequential transfer | Throughput |
| Random 4K Write | 52,000 IOPS | Quick app background updates | IOPS |
| Endurance Rating | 300+ TBW (256GB) | Long multi-year endurance | Durability |
Summary of the architecture and published performance data for Kioxia 96-Layer 3D BiCS FLASH UFS 3.0 Storage Subsystem.
High-reliability 96-layer 3D BiCS flash memory delivering up to 2,050 MB/s read speed with advanced wear-leveling.
Kioxia 96-Layer 3D BiCS FLASH UFS 3.0 Storage Subsystem is a high-speed non-volatile mobile storage solution engineered by Kioxia Corporation.
Kioxia's UFS 3.0 solution pairs its celebrated 96-layer 3D BiCS FLASH memory with an ultra-efficient controller. Delivering up to 2,050 MB/s sequential read and 58,000 random read IOPS, it provides blistering load speeds for mobile gaming and instantaneous continuous burst photo caching while maintaining optimal thermals.
With an overall MxMob evaluation score of 8.8/10, the Kioxia BiCS FLASH UFS 3.0 represents a proven and reliable silicon solution optimized for mainstream commercial smartphones.
Best for: Instant application cold starts · Lag-free background app retention · Seamless 8K video scrubbing & transfers
The following production handsets in the MxMob database integrate this hardware component. Click any device to read its complete specification sheet.
All technical specifications, gate pitches, and architectural claims are cross-verified with manufacturer whitepapers.
BiCS FLASH stacks cells vertically, eliminating inter-cell capacitive coupling and dramatically boosting data write speeds while consuming less power.
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