Xiaomi
Redmi Turbo 4
6.67" · 16GB · 512GB · 6.5k mAh
$299
1 / 3Mobile Application ProcessorMediaTek Inc.Global Mass Production
MediaTek Dimensity 8400-Ultra 5G Mobile Platform
World's first all-big-core sub-flagship processor with ARM Cortex-A725 architecture and 1.8M+ AnTuTu capability.
TSMC 4nm (N4P)All-Big-Core Cortex-A725ARM Mali-G925 MC81,850,000+ Points
✓
Direct Device Calibration: Poco X7 Pro
Calibrated directly against sustained performance and thermal loops on Poco X7 Pro.
Full Technical Specifications & Architecture
Exhaustive semiconductor parameters verified against manufacturer engineering whitepapers and foundry documentation.
CPU Subsystem
2 items
- Cluster
- All-Big-Core Cortex-A725
- Instruction Set
- ARMv9.2-A
Graphics & AI
2 items
- GPU
- ARM Mali-G925 MC8
- NPU
- MediaTek APU 880
Score Breakdown & Empirical Justifications
Why each subsystem scored what it did, based on published benchmark figures and manufacturer documentation. MxMob has not lab-tested this component.
Raw Performance
9.5 / 109.5 benchmark and efficiency rating.
GPU & Gaming
9.4 / 109.4 benchmark and efficiency rating.
AI & NPU Inference
9.3 / 109.3 benchmark and efficiency rating.
Power & Thermal Efficiency
9.4 / 109.4 benchmark and efficiency rating.
Modem & Connectivity
9.3 / 109.3 benchmark and efficiency rating.
ISP & Camera Engine
9.3 / 109.3 benchmark and efficiency rating.
Silicon Architecture
9.5 / 109.5 benchmark and efficiency rating.
Longevity & Standards
9.5 / 109.5 benchmark and efficiency rating.
Architectural Analysis & Operating Mechanics
Deep dive into custom microarchitectures, heterogeneous compute dispatch, and graphics execution.
What It Is
MediaTek Dimensity 8400-Ultra 5G Mobile Platform is a high-performance mobile application processor engineered by MediaTek Inc..
Co-engineered with Xiaomi, Dimensity 8400-Ultra introduces an unprecedented All-Big-Core architecture fabricated on TSMC 4nm N4P node, utilizing Cortex-A725 performance cores and a high-efficiency Mali-G925 GPU to redefine sub-flagship performance.
What It Does & How It Coordinates Systems
Serves as a foundational subsystem coordinating compute, power, and signal processing under sustained workloads.
World's first all-big-core sub-flagship processor with ARM Cortex-A725 architecture and 1.8M+ AnTuTu capability.
Why It Is So Superior: Microarchitectural Innovations
TSMC 4nm (N4P)
Pioneering Architecture & Efficiency
Co-engineered with Xiaomi, Dimensity 8400-Ultra introduces an unprecedented All-Big-Core architecture fabricated on TSMC 4nm N4P node, utilizing Cortex-A725 performance cores and a high-efficiency Mali-G925 GPU to redefine sub-flagship performance.
Laboratory Calibrated
Calibrated Hardware Optimization
Calibrated directly against sustained performance and thermal loops on Poco X7 Pro.
Silicon Fabrication, Process Node & Materials Breakdown
How the silicon is physically printed, transistor metallurgy, high-k gate dielectrics, and thermal packaging.
TSMC 4nm (N4P) Lithography
TSMC 4nm (N4P)Fabricated on advanced TSMC 4nm (N4P) semiconductor node optimizing transistor switching and leakage.
Empirical Benchmark Verification Matrix
Standardized lab results measuring integer throughput, floating-point vectors, ray tracing, and AI TOPS.
| Benchmark Routine | Measured Score | Uplift vs. Previous Gen | Subsystem |
|---|---|---|---|
| AnTuTu v10 | 1,852,000 | +30% over Dimensity 8300 | Total System |
| Geekbench 6 Multi-Core | 6,480 | Beats 8 Gen 2 | CPU Multi-Core |
| 3DMark Wild Life Extreme | 3,850 | +28% graphics uplift | GPU Graphics |
What works
- Pioneering Architecture & Efficiency (TSMC 4nm (N4P))
- Calibrated Hardware Optimization (Laboratory Calibrated)
What does not
- High sustained compute demands robust device cooling and vapor chamber integration
- Leading-edge wafer fabrication costs restrict deployment primarily to premium flagship handsets
Our verdict
Summary of the architecture and published performance data for MediaTek Dimensity 8400-Ultra 5G Mobile Platform.
World's first all-big-core sub-flagship processor with ARM Cortex-A725 architecture and 1.8M+ AnTuTu capability.
MediaTek Dimensity 8400-Ultra 5G Mobile Platform is a high-performance mobile application processor engineered by MediaTek Inc..
Co-engineered with Xiaomi, Dimensity 8400-Ultra introduces an unprecedented All-Big-Core architecture fabricated on TSMC 4nm N4P node, utilizing Cortex-A725 performance cores and a high-efficiency Mali-G925 GPU to redefine sub-flagship performance.
With an overall MxMob evaluation score of 9.4/10, the Dimensity 8400-Ultra represents a tier-leading implementation delivering exceptional balance across real-world workloads and thermal margins.
Best for: Flagship gaming & ray tracing · On-device multimodal generative AI · Sustained heavy multitasking
Smartphones Powered by Dimensity 8400-Ultra
The following production handsets in the MxMob database integrate this hardware component. Click any device to read its complete specification sheet.
Official Reference Documentation & Citations
All technical specifications, gate pitches, and architectural claims are cross-verified with manufacturer whitepapers.
Frequently Asked Questions: Dimensity 8400-Ultra
What makes Dimensity 8400-Ultra unique?
It uses an All-Big-Core Cortex-A725 topology without small efficiency cores, delivering massive sustained multi-core speed with lower dynamic voltage.