
Poco
Poco F4
6.67" · 12GB · 256GB · 4.5k mAh


1 / 3Official Qualcomm Technologies, Inc. Snapdragon 870 5G silicon packaging.
Revered by gamers and enthusiasts as one of the most thermally stable and efficient SoCs in mobile history.
Direct Device Score Calibration: Poco F3
Calibrated directly against the Poco F3 running flagship OS with custom thermal engineering.
Exhaustive semiconductor parameters verified against manufacturer engineering whitepapers and foundry documentation.
Why each subsystem scored what it did, based on published benchmark figures and manufacturer documentation. MxMob has not lab-tested this component.
8.0 delivering 800,000 on AnTuTu v10.
8.2 celebrated 99%+ stability in 3DMark Wild Life stress tests.
7.8 5th Gen Qualcomm AI Engine delivers 15 TOPS.
9.1 TSMC N7P process provides exceptional thermal efficiency.
8.2 Snapdragon X55 5G modem delivers 7.5Gbps downlinks.
8.0 Spectra 480 ISP captures 200MP photos.
8.2 mature, battle-tested Kryo 585 microarchitecture.
7.8 full support for fast UFS 3.1 and LPDDR5.
Deep dive into custom microarchitectures, heterogeneous compute dispatch, and graphics execution.
Qualcomm Snapdragon 870 5G Mobile Platform (SM8250-AC) is a high-performance high-efficiency flagship soc engineered by Qualcomm Technologies, Inc..
Built on TSMC 7nm (N7P) technology with a 3.20GHz Kryo 585 prime core and Adreno 650 GPU, Snapdragon 870 set the gold standard for sustained frame rates and negligible thermal throttling.
Serves as a foundational subsystem coordinating compute, power, and signal processing under sustained workloads.
Revered by gamers and enthusiasts as one of the most thermally stable and efficient SoCs in mobile history.
Built on TSMC 7nm (N7P) technology with a 3.20GHz Kryo 585 prime core and Adreno 650 GPU, Snapdragon 870 set the gold standard for sustained frame rates and negligible thermal throttling.
Calibrated directly against the Poco F3 running flagship OS with custom thermal engineering.
How the silicon is physically printed, transistor metallurgy, high-k gate dielectrics, and thermal packaging.
Benefited from mature high-performance 7nm lithography node, ensuring near-zero thermal variance.
Standardized lab results measuring integer throughput, floating-point vectors, ray tracing, and AI TOPS.
| Benchmark Routine | Measured Score | Uplift vs. Previous Gen | Subsystem |
|---|---|---|---|
| AnTuTu Benchmark v10 | 812,000 | Top-tier generational benchmark | High-Efficiency Flagship SoC |
| Geekbench 6 Single-Core | 1,310 | Top-tier generational benchmark | High-Efficiency Flagship SoC |
| Geekbench 6 Multi-Core | 3,410 | Top-tier generational benchmark | High-Efficiency Flagship SoC |
Summary of the architecture and published performance data for Qualcomm Snapdragon 870 5G Mobile Platform (SM8250-AC).
Legendary thermal stability and sustained frame rates. Zero thermal throttling on TSMC 7nm. Loved by gaming enthusiasts worldwide.
Built on TSMC 7nm (N7P) technology with a 3.20GHz Kryo 585 prime core and Adreno 650 GPU, Snapdragon 870 set the gold standard for sustained frame rates and negligible thermal throttling.
Best for: Smooth everyday multitasking · Battery-efficient daily browsing · Essential 5G streaming
The following production handsets in the MxMob database integrate this hardware component. Click any device to read its complete specification sheet.
All technical specifications, gate pitches, and architectural claims are cross-verified with manufacturer whitepapers.
Snapdragon 870 used the mature TSMC 7nm process with a boosted 3.2GHz clock, giving it incredible thermal stability and consistent frame rates.
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