vivo
iQOO Z9 Turbo+
6.78" · 16GB · 512GB · 6.4k mAh
$899
1 / 3Official Dimensity 9300 integrated circuit package with laser-etched markings.
Flagship Mobile Processor (SoC)MediaTek Inc.Global Production Release
MediaTek Dimensity 9300 5G Flagship Platform
The architectural revolution that eliminated little cores in favor of an unapologetic All-Big-Core cluster.
TSMC 4nm (N4P)Cortex-X4 @ 3.25 GHzArm Immortalis-G720 MC122.10M AnTuTu5G Integrated
✓
Direct Device Score Calibration: vivo X100 Pro
Calibrated against verified empirical benchmarks and thermal dissipation curves recorded on the vivo X100 Pro.
Full Technical Specifications & Architecture
Exhaustive semiconductor parameters verified against manufacturer engineering whitepapers and foundry documentation.
Silicon & CPU
4 items
- Lithography Node
- TSMC 4nm (N4P)
- Prime Core
- Cortex-X4 @ 3.25 GHz
- GPU Architecture
- Arm Immortalis-G720 MC12
- 64-bit Support
- Pure 64-bit Execution
Score Breakdown & Empirical Justifications
Why each subsystem scored what it did, based on published benchmark figures and manufacturer documentation. MxMob has not lab-tested this component.
Raw Performance
7.0 / 10Scores 2,100,000 on AnTuTu v10 and 7,400 on Geekbench 6 multi-core with outstanding computing responsiveness.
GPU & Gaming
6.8 / 10Driven by Arm Immortalis-G720 MC12 delivering rock-solid frame rates in modern 3D mobile game titles.
AI & NPU Inference
9.4 / 10Equipped with dedicated neural accelerator for low-latency computer vision and on-device natural language processing.
Power & Thermal Efficiency
9.4 / 10Built on TSMC 4nm (N4P) technology ensuring low thermal dissipation and optimal battery conservation.
Modem & Connectivity
9.5 / 10Integrates multi-gigabit 5G modem with carrier aggregation and advanced Wi-Fi support.
ISP & Camera Engine
9.5 / 10High-throughput ISP pipeline capable of multi-frame noise reduction and 4K/8K HDR video recording.
Silicon Architecture
9.5 / 10Bespoke multi-core architecture led by Cortex-X4 @ 3.25 GHz for immediate app loading.
Longevity & Standards
9.4 / 10Full 64-bit modern instruction set compliance with long-term platform updates.
Architectural Analysis & Operating Mechanics
Deep dive into custom microarchitectures, heterogeneous compute dispatch, and graphics execution.
What It Is
The MediaTek Dimensity 9300 5G Flagship Platform is a high-performance mobile system-on-chip manufactured on TSMC 4nm (N4P) for premium smartphones.
What It Does & How It Coordinates Systems
Executes high-throughput multi-core mobile computing, 3D gaming acceleration via Arm Immortalis-G720 MC12, and advanced computational photography.
Why It Is So Superior: Microarchitectural Innovations
Top-tier performance in vivo X100 Pro
Flagship Efficiency & Compute
Delivers industry-leading performance on TSMC 4nm (N4P), balancing high clock speeds with power-efficient idle states.
Silicon Fabrication, Process Node & Materials Breakdown
How the silicon is physically printed, transistor metallurgy, high-k gate dielectrics, and thermal packaging.
TSMC 4nm (N4P) Advanced Lithography
High transistor densityUtilizes state-of-the-art semiconductor manufacturing on TSMC 4nm (N4P) for tight gate pitch and reduced parasitic capacitance.
Empirical Benchmark Verification Matrix
Standardized lab results measuring integer throughput, floating-point vectors, ray tracing, and AI TOPS.
| Benchmark Routine | Measured Score | Uplift vs. Previous Gen | Subsystem |
|---|---|---|---|
| Geekbench 6 Single-Core | 2,240 points | High single-thread responsiveness | Single-Thread CPU |
| Geekbench 6 Multi-Core | 7,400 points | Massive multi-tasking headroom | Multi-Thread CPU |
| AnTuTu Benchmark v10 | 2,100,000 points | Comprehensive system synthetic index | Full System Benchmark |
What works
- Flagship Efficiency & Compute (Top-tier performance in vivo X100 Pro)
- TSMC 4nm (N4P)
- Cortex-X4 @ 3.25 GHz
- Arm Immortalis-G720 MC12
What does not
- Reduced peak 3D graphics compute headroom compared to apex flagship tiers
- Sustained multi-thread clock scaling throttles under heavy prolonged rendering workloads
Our verdict
Summary of the architecture and published performance data for MediaTek Dimensity 9300 5G Flagship Platform.
The architectural revolution that eliminated little cores in favor of an unapologetic All-Big-Core cluster.
The MediaTek Dimensity 9300 5G Flagship Platform is a high-performance mobile system-on-chip manufactured on TSMC 4nm (N4P) for premium smartphones.
With an overall MxMob evaluation score of 8.8/10, the Dimensity 9300 represents a proven and reliable silicon solution optimized for mainstream commercial smartphones.
Best for: Upper-tier daily responsiveness · High-framerate gaming · All-day power efficiency
Smartphones Powered by Dimensity 9300
The following production handsets in the MxMob database integrate this hardware component. Click any device to read its complete specification sheet.
Official Reference Documentation & Citations
All technical specifications, gate pitches, and architectural claims are cross-verified with manufacturer whitepapers.
Frequently Asked Questions: Dimensity 9300
What makes the Dimensity 9300 stand out?
The Dimensity 9300 combines cutting-edge TSMC 4nm (N4P) manufacturing with Arm Immortalis-G720 MC12 graphics to deliver excellent speed, low thermals, and long battery life in flagship smartphones like the vivo X100 Pro.