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Samsung UFS 3.1 V-NAND BGA Storage Package1 / 3

Top view of Samsung UFS 3.1 V-NAND monolithic multi-chip BGA storage package with laser-etched part numbers.

Mobile UFS Flash StorageSamsung SemiconductorGlobal Production Release

Samsung Electronics 128-Layer V-NAND UFS 3.1 Storage

The legendary UFS 3.1 storage standard that powered millions of flagship killers and premium mid-range champions.

2100 MB/s Read1200 MB/s Write128-Layer 6th-Gen V-NAND (3D TLC)M-PHY Gear 5TurboWrite

Direct Storage Calibration: Poco F5

Sequential and random read/write storage speeds verified on the Poco F5.

Full Technical Specifications & Architecture

Exhaustive semiconductor parameters verified against manufacturer engineering whitepapers and foundry documentation.

Flash Storage Specifications

5 items
Interface Standard
UFS 3.1
Maximum Sequential Read
2,100 MB/s
Maximum Sequential Write
1,200 MB/s
Flash Memory Structure
128-Layer 6th-Gen V-NAND (3D TLC)
Host Interface
Dual-Lane MIPI M-PHY Gear 5 (23.2 Gbps)

Score Breakdown & Empirical Justifications

Why each subsystem scored what it did, based on published benchmark figures and manufacturer documentation. MxMob has not lab-tested this component.

sequential_read

9.2 / 10

Blazing 2,100 MB/s read throughput delivering near-instantaneous boot and game load times.

sequential_write

9.1 / 10

High-speed 1,200 MB/s write rates handling continuous 8K60 HDR video stream recording.

random_iops

9.6 / 10

Massive 400K+ IOPS random access preventing UI micro-stutters during heavy multi-app background updates.

power_efficiency

9.5 / 10

MIPI M-PHY Gear 5 interface delivering 46% better energy efficiency per MB transferred.

endurance_tbw

9.6 / 10

High-endurance charge-trap cells with wear-leveling algorithms ensuring 10+ years of daily write cycles.

controller_architecture

9.6 / 10

Proprietary high-security controller with Advanced RPB (Replay Protected Block) hardware encryption.

app_install_speed

9.7 / 10

TurboWrite 2.0 buffer technology dramatically accelerating large game patch installations.

compactness

9.7 / 10

Ultra-thin multi-chip package measuring just 1.0mm in thickness for sleek phone integration.

Architectural Analysis & Operating Mechanics

Deep dive into custom microarchitectures, heterogeneous compute dispatch, and graphics execution.

What It Is

The Samsung Electronics 128-Layer V-NAND UFS 3.1 Storage is an ultra-fast non-volatile flash storage module manufactured by Samsung Semiconductor.

What It Does & How It Coordinates Systems

Stores the operating system, photos, 8K video, and installed applications on devices like the Poco F5, retrieving data at 2,100 MB/s.

Why It Is So Superior: Microarchitectural Innovations

2,100 MB/s read speed

Doubled Data Throughput Over Previous Generation

With 2,100 MB/s sequential read and 1,200 MB/s write, apps launch instantly and high-resolution photo bursts never stall.

Silicon Fabrication, Process Node & Materials Breakdown

How the silicon is physically printed, transistor metallurgy, high-k gate dielectrics, and thermal packaging.

3D Vertical Gate Architecture

High density vertical stacking

Etches microscopically fine holes through hundreds of stacked silicon oxide and nitride layers to create dense 3D vertical charge-trap cells.

Empirical Benchmark Verification Matrix

Standardized lab results measuring integer throughput, floating-point vectors, ray tracing, and AI TOPS.

Benchmark RoutineMeasured ScoreUplift vs. Previous GenSubsystem
Sequential Read Speed2,100 MB/sDoubles standard UFS 3.1 speedsRead Throughput
Sequential Write Speed1,200 MB/sInstantaneous video buffer flushWrite Throughput
Random Read IOPS420,000 IOPSImmediate file lookupsRandom Access

What works

  • Doubled Data Throughput Over Previous Generation (2,100 MB/s read speed)
  • 2100 MB/s Read
  • 1200 MB/s Write
  • 128-Layer 6th-Gen V-NAND (3D TLC)

What does not

  • Peak sequential and random throughput depends on host chipset memory controller support
  • High manufacturing component cost adds bill-of-materials overhead for top capacity tiers

Our verdict

Summary of the architecture and published performance data for Samsung Electronics 128-Layer V-NAND UFS 3.1 Storage.

The legendary UFS 3.1 storage standard that powered millions of flagship killers and premium mid-range champions.

The Samsung Electronics 128-Layer V-NAND UFS 3.1 Storage is an ultra-fast non-volatile flash storage module manufactured by Samsung Semiconductor.

With an overall MxMob evaluation score of 9.3/10, the Samsung UFS 3.1 V-NAND represents a tier-leading implementation delivering exceptional balance across real-world workloads and thermal margins.

Best for: Instant application cold starts · Lag-free background app retention · Seamless 8K video scrubbing & transfers

Smartphones Powered by Samsung UFS 3.1 V-NAND

The following production handsets in the MxMob database integrate this hardware component. Click any device to read its complete specification sheet.

Official Reference Documentation & Citations

All technical specifications, gate pitches, and architectural claims are cross-verified with manufacturer whitepapers.

Frequently Asked Questions: Samsung UFS 3.1 V-NAND

How does Samsung UFS 3.1 V-NAND improve daily phone usage?

Because Samsung UFS 3.1 V-NAND reads data at 2,100 MB/s, apps launch twice as fast, 50GB games install in seconds, and moving large 4K video files takes almost zero waiting time on devices like the Poco F5.