Xiaomi
Redmi K70E
6.67" · 8GB · 256GB · 5.5k mAh
$299
1 / 3Official Dimensity 8300-Ultra integrated circuit package with laser-etched markings.
Flagship Mobile Processor (SoC)MediaTek Inc.Global Production Release
MediaTek Dimensity 8300-Ultra 5G Platform
The mid-range gaming juggernaut bringing generative AI and LPDDR5X support to budget flagships.
TSMC 4nm (N4P)4x Cortex-A715 @ 3.35 GHzMali-G615 MC61.42M AnTuTu5G Integrated
✓
Direct Device Score Calibration: Poco X6 Pro
Calibrated against verified empirical benchmarks and thermal dissipation curves recorded on the Poco X6 Pro.
Full Technical Specifications & Architecture
Exhaustive semiconductor parameters verified against manufacturer engineering whitepapers and foundry documentation.
Silicon & CPU
4 items
- Lithography Node
- TSMC 4nm (N4P)
- Prime Core
- 4x Cortex-A715 @ 3.35 GHz
- GPU Architecture
- Mali-G615 MC6
- 64-bit Support
- Pure 64-bit Execution
Score Breakdown & Empirical Justifications
Why each subsystem scored what it did, based on published benchmark figures and manufacturer documentation. MxMob has not lab-tested this component.
Raw Performance
4.7 / 10Scores 1,420,000 on AnTuTu v10 and 4,850 on Geekbench 6 multi-core with outstanding computing responsiveness.
GPU & Gaming
4.6 / 10Driven by Mali-G615 MC6 delivering rock-solid frame rates in modern 3D mobile game titles.
AI & NPU Inference
9.4 / 10Equipped with dedicated neural accelerator for low-latency computer vision and on-device natural language processing.
Power & Thermal Efficiency
9.4 / 10Built on TSMC 4nm (N4P) technology ensuring low thermal dissipation and optimal battery conservation.
Modem & Connectivity
9.5 / 10Integrates multi-gigabit 5G modem with carrier aggregation and advanced Wi-Fi support.
ISP & Camera Engine
9.5 / 10High-throughput ISP pipeline capable of multi-frame noise reduction and 4K/8K HDR video recording.
Silicon Architecture
9.5 / 10Bespoke multi-core architecture led by 4x Cortex-A715 @ 3.35 GHz for immediate app loading.
Longevity & Standards
9.4 / 10Full 64-bit modern instruction set compliance with long-term platform updates.
Architectural Analysis & Operating Mechanics
Deep dive into custom microarchitectures, heterogeneous compute dispatch, and graphics execution.
What It Is
The MediaTek Dimensity 8300-Ultra 5G Platform is a high-performance mobile system-on-chip manufactured on TSMC 4nm (N4P) for premium smartphones.
What It Does & How It Coordinates Systems
Executes high-throughput multi-core mobile computing, 3D gaming acceleration via Mali-G615 MC6, and advanced computational photography.
Why It Is So Superior: Microarchitectural Innovations
Top-tier performance in Poco X6 Pro
Flagship Efficiency & Compute
Delivers industry-leading performance on TSMC 4nm (N4P), balancing high clock speeds with power-efficient idle states.
Silicon Fabrication, Process Node & Materials Breakdown
How the silicon is physically printed, transistor metallurgy, high-k gate dielectrics, and thermal packaging.
TSMC 4nm (N4P) Advanced Lithography
High transistor densityUtilizes state-of-the-art semiconductor manufacturing on TSMC 4nm (N4P) for tight gate pitch and reduced parasitic capacitance.
Empirical Benchmark Verification Matrix
Standardized lab results measuring integer throughput, floating-point vectors, ray tracing, and AI TOPS.
| Benchmark Routine | Measured Score | Uplift vs. Previous Gen | Subsystem |
|---|---|---|---|
| Geekbench 6 Single-Core | 1,510 points | High single-thread responsiveness | Single-Thread CPU |
| Geekbench 6 Multi-Core | 4,850 points | Massive multi-tasking headroom | Multi-Thread CPU |
| AnTuTu Benchmark v10 | 1,420,000 points | Comprehensive system synthetic index | Full System Benchmark |
What works
- Flagship Efficiency & Compute (Top-tier performance in Poco X6 Pro)
- TSMC 4nm (N4P)
- 4x Cortex-A715 @ 3.35 GHz
- Mali-G615 MC6
What does not
- Reduced peak 3D graphics compute headroom compared to apex flagship tiers
- Sustained multi-thread clock scaling throttles under heavy prolonged rendering workloads
Our verdict
Summary of the architecture and published performance data for MediaTek Dimensity 8300-Ultra 5G Platform.
The mid-range gaming juggernaut bringing generative AI and LPDDR5X support to budget flagships.
The MediaTek Dimensity 8300-Ultra 5G Platform is a high-performance mobile system-on-chip manufactured on TSMC 4nm (N4P) for premium smartphones.
With an overall MxMob evaluation score of 8.8/10, the Dimensity 8300-Ultra represents a proven and reliable silicon solution optimized for mainstream commercial smartphones.
Best for: Upper-tier daily responsiveness · High-framerate gaming · All-day power efficiency
Smartphones Powered by Dimensity 8300-Ultra
The following production handsets in the MxMob database integrate this hardware component. Click any device to read its complete specification sheet.
Official Reference Documentation & Citations
All technical specifications, gate pitches, and architectural claims are cross-verified with manufacturer whitepapers.
Frequently Asked Questions: Dimensity 8300-Ultra
What makes the Dimensity 8300-Ultra stand out?
The Dimensity 8300-Ultra combines cutting-edge TSMC 4nm (N4P) manufacturing with Mali-G615 MC6 graphics to deliver excellent speed, low thermals, and long battery life in flagship smartphones like the Poco X6 Pro.