OnePlus
Nubia Redmagic 9 Pro
6.9" · 16GB · 512GB · 5k mAh


1 / 3Physical packaging view of Nubia ICE Cooling Turbofan & VC.
The world's premier active mobile thermal system with a 22,000 RPM turbofan and 10,182mm² 3D vapor chamber.
Direct Device Score Calibration: RedMagic 9 Pro
Charging speeds, thermal dissipation curves, and battery cycle retention calibrated against the RedMagic 9 Pro.
Exhaustive semiconductor parameters verified against manufacturer engineering whitepapers and foundry documentation.
Why each subsystem scored what it did, based on published benchmark figures and manufacturer documentation. MxMob has not lab-tested this component.
9.2 allows continuous 80W-165W fast charging while gaming without thermal throttling.
9.6 keeping battery under 35°C during gaming preserves 90%+ capacity over years.
9.2 compact packaging accommodates massive 6500mAh battery.
10.0 unmatchable active cooling drops CPU die temperature by up to 18°C.
9.7 dust-proof internal air duct isolated from sensitive motherboard electronics.
9.8 high airflow at only 0.1W fan power draw.
9.2 bypass charging powers the chip directly without charging the battery to avoid heat.
9.7 miniature centrifugal fan rated for 30,000 continuous hours.
Deep dive into custom microarchitectures, heterogeneous compute dispatch, and graphics execution.
Nubia ICE 13.0 Multi-Dimensional Active Turbofan & 3D Vapor Chamber Cooling is a high-performance battery, fast charging & cooling technology engineered by Nubia Technology / RedMagic.
Engineered for hardcore continuous mobile gaming, Nubia's ICE cooling system combines a 22,000 RPM centrifugal turbofan with waterfall air ducts, a 10,182mm² double-layer 3D vapor chamber, and under-screen aerospace graphene to lower CPU core temperatures by up to 18°C.
Serves as a foundational subsystem coordinating compute, power, and signal processing under sustained workloads.
The world's premier active mobile thermal system with a 22,000 RPM turbofan and 10,182mm² 3D vapor chamber.
Engineered for hardcore continuous mobile gaming, Nubia's ICE cooling system combines a 22,000 RPM centrifugal turbofan with waterfall air ducts, a 10,182mm² double-layer 3D vapor chamber, and under-screen aerospace graphene to lower CPU core temperatures by up to 18°C.
Charging speeds, thermal dissipation curves, and battery cycle retention calibrated against the RedMagic 9 Pro.
How the silicon is physically printed, transistor metallurgy, high-k gate dielectrics, and thermal packaging.
Draws cool air from the rear intake, accelerates it across high-fin copper radiators, and exhausts heat out the side vent without exposing electronics to dust.
Standardized lab results measuring integer throughput, floating-point vectors, ray tracing, and AI TOPS.
| Benchmark Routine | Measured Score | Uplift vs. Previous Gen | Subsystem |
|---|---|---|---|
| CPU Temp Drop Under Load | 18.0 | Top-tier generational benchmark | Battery, Fast Charging & Cooling Technology |
| Wild Life Stress Stability | 99.4 | Top-tier generational benchmark | Battery, Fast Charging & Cooling Technology |
Summary of the architecture and published performance data for Nubia ICE 13.0 Multi-Dimensional Active Turbofan & 3D Vapor Chamber Cooling.
22,000 RPM active cooling fan. 10,182mm² massive 3D vapor chamber. 99.4% sustained performance stability in heavy games.
Engineered for hardcore continuous mobile gaming, Nubia's ICE cooling system combines a 22,000 RPM centrifugal turbofan with waterfall air ducts, a 10,182mm² double-layer 3D vapor chamber, and under-screen aerospace graphene to lower CPU core temperatures by up to 18°C.
Best for: All-day heavy user endurance · Rapid top-up charging sessions · Long-term battery health cycle retention
The following production handsets in the MxMob database integrate this hardware component. Click any device to read its complete specification sheet.
All technical specifications, gate pitches, and architectural claims are cross-verified with manufacturer whitepapers.
The 22,000 RPM fan operates at under 28 decibels—virtually silent in normal environments—while moving enough air to drop internal chip temperatures by 18°C.
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