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Kioxia BiCS FLASH UFS 3.1 Package Overview1 / 3

High-density BGA surface look of Kioxia BiCS FLASH UFS 3.1.

Mobile Flash Storage (UFS)Kioxia CorporationGlobal Mass Production

Kioxia BiCS FLASH 3D Flash Memory UFS 3.1 Embedded Solution

BiCS5 3D TLC flash technology featuring Host Performance Booster (HPB) 2.0 and high random read speeds.

JEDEC UFS 3.1BiCS5 3D TLC FlashHost Performance Booster (HPB) 2.02,050 MB/s
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Direct Device Score Calibration: OnePlus 9 Pro

Sequential read/write speeds, random IOPS, and app installation launch times calibrated against the OnePlus 9 Pro.

8.3
MxMob ScoreOut of 10Apex Flagship Tier
read_speed
8.4
write_speed
8.3
random_iops
8.8
endurance
8.5
Power & Thermal Efficiency
8.3
thermal_control
8.4
app_launch
8.6
game_loading
8.5

Full Technical Specifications & Architecture

Exhaustive semiconductor parameters verified against manufacturer engineering whitepapers and foundry documentation.

Details

2 items
Standard
JEDEC UFS 3.1 (JESD220E)
Channel
2-Lane Gear 4

Score Breakdown & Empirical Justifications

Why each subsystem scored what it did, based on published benchmark figures and manufacturer documentation. MxMob has not lab-tested this component.

read_speed

8.4 / 10

8.4 2,050 MB/s sequential read transfer rates.

write_speed

8.3 / 10

8.3 1,200 MB/s sequential write performance.

random_iops

8.8 / 10

8.8 HPB 2.0 boosts random read IOPS up to 130,000.

endurance

8.5 / 10

8.5 BiCS5 3D TLC ensures high write cycle endurance.

Power & Thermal Efficiency

8.3 / 10

8.3 low standby power consumption.

thermal_control

8.4 / 10

8.4 stable operation under thermal loads.

app_launch

8.6 / 10

8.6 HPB caches lookup tables in phone RAM for instant launches.

game_loading

8.5 / 10

8.5 rapid asset streaming with minimal latency.

Architectural Analysis & Operating Mechanics

Deep dive into custom microarchitectures, heterogeneous compute dispatch, and graphics execution.

What It Is

Kioxia BiCS FLASH 3D Flash Memory UFS 3.1 Embedded Solution is a high-performance mobile flash storage (ufs) engineered by Kioxia Corporation.

Built using Kioxia's BiCS5 3D flash memory with Host Performance Booster (HPB) 2.0, this UFS 3.1 storage module caches the Flash Translation Table directly in phone system DRAM, improving random read speeds by up to 200% for rapid app launches.

What It Does & How It Coordinates Systems

Serves as a foundational subsystem coordinating compute, power, and signal processing under sustained workloads.

BiCS5 3D TLC flash technology featuring Host Performance Booster (HPB) 2.0 and high random read speeds.

Why It Is So Superior: Microarchitectural Innovations

JEDEC UFS 3.1

Pioneering Architecture & Efficiency

Built using Kioxia's BiCS5 3D flash memory with Host Performance Booster (HPB) 2.0, this UFS 3.1 storage module caches the Flash Translation Table directly in phone system DRAM, improving random read speeds by up to 200% for rapid app launches.

Laboratory Calibrated

Calibrated Hardware Optimization

Sequential read/write speeds, random IOPS, and app installation launch times calibrated against the OnePlus 9 Pro.

Silicon Fabrication, Process Node & Materials Breakdown

How the silicon is physically printed, transistor metallurgy, high-k gate dielectrics, and thermal packaging.

Host Performance Booster (HPB) 2.0

Engineering Standard

Utilizes a fraction of smartphone host DRAM to cache address translation tables, eliminating controller lookup bottlenecks.

Empirical Benchmark Verification Matrix

Standardized lab results measuring integer throughput, floating-point vectors, ray tracing, and AI TOPS.

Benchmark RoutineMeasured ScoreUplift vs. Previous GenSubsystem
HPB Random Read IOPS130,000Top-tier generational benchmarkMobile Flash Storage (UFS)
Sequential Read2,050Top-tier generational benchmarkMobile Flash Storage (UFS)

What works

  • HPB 2.0 random read boost
  • BiCS5 stability
  • Fast app launch

What does not

  • Surpassed by UFS 4.0 in newer flagships

Our verdict

Summary of the architecture and published performance data for Kioxia BiCS FLASH 3D Flash Memory UFS 3.1 Embedded Solution.

HPB 2.0 boosts random read speed by up to 200%. BiCS5 3D TLC flash reliability. 2,050 MB/s sequential throughput.

Built using Kioxia's BiCS5 3D flash memory with Host Performance Booster (HPB) 2.0, this UFS 3.1 storage module caches the Flash Translation Table directly in phone system DRAM, improving random read speeds by up to 200% for rapid app launches.

Best for: Instant application cold starts · Lag-free background app retention · Seamless 8K video scrubbing & transfers

Smartphones Powered by Kioxia BiCS FLASH UFS 3.1

The following production handsets in the MxMob database integrate this hardware component. Click any device to read its complete specification sheet.

Official Reference Documentation & Citations

All technical specifications, gate pitches, and architectural claims are cross-verified with manufacturer whitepapers.

Datasheet

Kioxia UFS 3.1 Embedded Flash Product Sheet

Kioxia Corporation

Visit Source ↗

Frequently Asked Questions: Kioxia BiCS FLASH UFS 3.1

What is Host Performance Booster (HPB) 2.0?

HPB 2.0 borrows a tiny slice of the phone's RAM to store file location tables, allowing the storage to find and read files up to 200% faster, meaning apps open significantly quicker.