
Realme
GT 6
6.78" · 16GB · 512GB · 5.5k mAh


1 / 3Physical FBGA packaging of SK Hynix LPDDR5 6400Mbps.
High-K Metal Gate low-leakage transistor architecture delivering stable 6400 Mbps mobile computing.
Direct Device Score Calibration: Poco F3
DRAM read/write bandwidth and background app holding stability calibrated against the Poco F3.
Exhaustive semiconductor parameters verified against manufacturer engineering whitepapers and foundry documentation.
Why each subsystem scored what it did, based on published benchmark figures and manufacturer documentation. MxMob has not lab-tested this component.
8.1 51.2 GB/s bandwidth for smooth 120Hz system navigation.
8.0 tight timing parameters ensure fast memory turnaround.
8.3 HKMG process eliminates gate leakage during phone sleep states.
8.1 16Gb monolithic die capacity.
8.0 reliable throughput for real-time camera computer vision.
8.3 low operating heat prevents thermal accumulation.
8.2 robust multitasking capability in premium mid-range phones.
8.7 rigorous burn-in testing ensures automotive-grade longevity.
Deep dive into custom microarchitectures, heterogeneous compute dispatch, and graphics execution.
SK Hynix 1z-nm 16Gb LPDDR5 6400 Mbps Low-Power DRAM is a high-performance mobile memory (ram) engineered by SK Hynix Inc..
Built on SK Hynix's 1z-nm node with High-K Metal Gate (HKMG) insulating dielectrics, this 16Gb LPDDR5 DRAM runs at 6400 Mbps, minimizing static power leakage and providing 51.2 GB/s data transfer rates.
Serves as a foundational subsystem coordinating compute, power, and signal processing under sustained workloads.
High-K Metal Gate low-leakage transistor architecture delivering stable 6400 Mbps mobile computing.
Built on SK Hynix's 1z-nm node with High-K Metal Gate (HKMG) insulating dielectrics, this 16Gb LPDDR5 DRAM runs at 6400 Mbps, minimizing static power leakage and providing 51.2 GB/s data transfer rates.
DRAM read/write bandwidth and background app holding stability calibrated against the Poco F3.
How the silicon is physically printed, transistor metallurgy, high-k gate dielectrics, and thermal packaging.
Replaces standard silicon dioxide with hafnium-based high-k materials to stop electrical leakage across sub-10nm gates.
Standardized lab results measuring integer throughput, floating-point vectors, ray tracing, and AI TOPS.
| Benchmark Routine | Measured Score | Uplift vs. Previous Gen | Subsystem |
|---|---|---|---|
| AIDA64 Read Throughput | 50,200 | Top-tier generational benchmark | Mobile Memory (RAM) |
| Sleep Power Draw | 0.45 | Top-tier generational benchmark | Mobile Memory (RAM) |
Summary of the architecture and published performance data for SK Hynix 1z-nm 16Gb LPDDR5 6400 Mbps Low-Power DRAM.
HKMG low-leakage technology. 51.2 GB/s high transfer bandwidth. Excellent standby battery life.
Built on SK Hynix's 1z-nm node with High-K Metal Gate (HKMG) insulating dielectrics, this 16Gb LPDDR5 DRAM runs at 6400 Mbps, minimizing static power leakage and providing 51.2 GB/s data transfer rates.
Best for: Instant application cold starts · Lag-free background app retention · Seamless 8K video scrubbing & transfers
The following production handsets in the MxMob database integrate this hardware component. Click any device to read its complete specification sheet.
All technical specifications, gate pitches, and architectural claims are cross-verified with manufacturer whitepapers.
High-K Metal Gate technology uses specialized hafnium insulators to prevent electrical current from leaking through microscopic transistor gates, drastically improving battery life when your phone is asleep.
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