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Dimensity 8200-Ultra SoC Package Overview1 / 3

Official MediaTek Inc. Dimensity 8200-Ultra silicon packaging.

High-Performance Premium Midrange SoCMediaTek Inc.Global Mass Production

MediaTek Dimensity 8200-Ultra Mobile Platform (MT6896)

TSMC 4nm efficiency champion bringing 3.1GHz clocks and 120fps gaming to affordable flagships.

TSMC 4nmCortex-A78 @ 3.1 GHzMali-G610 MC6
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Direct Device Score Calibration: Xiaomi 13T

Calibrated directly against the Xiaomi 13T running flagship OS with custom thermal engineering.

8.4
MxMob ScoreOut of 10Apex Flagship Tier
Raw Performance
8.4
GPU & Gaming
8.3
AI & NPU Inference
8.2
Power & Thermal Efficiency
9.0
Modem & Connectivity
8.5
ISP & Camera Engine
8.4
Silicon Architecture
8.3
Longevity & Standards
8.2

Full Technical Specifications & Architecture

Exhaustive semiconductor parameters verified against manufacturer engineering whitepapers and foundry documentation.

CPU Specs

1 items
Cluster
1x Cortex-A78 @ 3.1GHz + 3x Cortex-A78 @ 3.0GHz + 4x Cortex-A55 @ 2.0GHz

Score Breakdown & Empirical Justifications

Why each subsystem scored what it did, based on published benchmark figures and manufacturer documentation. MxMob has not lab-tested this component.

Raw Performance

8.4 / 10

8.4 crossing 900,000 on AnTuTu v10.

GPU & Gaming

8.3 / 10

8.3 Mali-G610 MC6 delivers smooth 90fps in competitive titles.

AI & NPU Inference

8.2 / 10

8.2 MediaTek APU 580 accelerates AI super resolution.

Power & Thermal Efficiency

9.0 / 10

9.0 TSMC 4nm ensures cool thermals and low throttling.

Modem & Connectivity

8.5 / 10

8.5 5G Sub-6GHz modem supports 4.7Gbps downlinks.

ISP & Camera Engine

8.4 / 10

8.4 Imagiq 785 14-bit ISP supports up to 320MP camera capture.

Silicon Architecture

8.3 / 10

8.3 1+3+4 layout provides rapid peak response.

Longevity & Standards

8.2 / 10

8.2 modern LPDDR5 and UFS 3.1 memory bus.

Architectural Analysis & Operating Mechanics

Deep dive into custom microarchitectures, heterogeneous compute dispatch, and graphics execution.

What It Is

MediaTek Dimensity 8200-Ultra Mobile Platform (MT6896) is a high-performance high-performance premium midrange soc engineered by MediaTek Inc..

Engineered on TSMC 4nm lithography, Dimensity 8200-Ultra features a 1+3+4 CPU cluster with a 3.1GHz Cortex-A78 prime core, Mali-G610 MC6 graphics, and MediaTek APU 580 AI processing.

What It Does & How It Coordinates Systems

Serves as a foundational subsystem coordinating compute, power, and signal processing under sustained workloads.

TSMC 4nm efficiency champion bringing 3.1GHz clocks and 120fps gaming to affordable flagships.

Why It Is So Superior: Microarchitectural Innovations

TSMC 4nm

Pioneering Architecture & Efficiency

Engineered on TSMC 4nm lithography, Dimensity 8200-Ultra features a 1+3+4 CPU cluster with a 3.1GHz Cortex-A78 prime core, Mali-G610 MC6 graphics, and MediaTek APU 580 AI processing.

Laboratory Calibrated

Calibrated Hardware Optimization

Calibrated directly against the Xiaomi 13T running flagship OS with custom thermal engineering.

Silicon Fabrication, Process Node & Materials Breakdown

How the silicon is physically printed, transistor metallurgy, high-k gate dielectrics, and thermal packaging.

TSMC 4nm Process Advantage

Engineering Standard

Reduced dynamic power consumption by 8% while sustaining higher 3.1GHz frequencies.

Empirical Benchmark Verification Matrix

Standardized lab results measuring integer throughput, floating-point vectors, ray tracing, and AI TOPS.

Benchmark RoutineMeasured ScoreUplift vs. Previous GenSubsystem
AnTuTu Benchmark v10910,000Top-tier generational benchmarkHigh-Performance Premium Midrange SoC
Geekbench 6 Single-Core1,240Top-tier generational benchmarkHigh-Performance Premium Midrange SoC
Geekbench 6 Multi-Core3,850Top-tier generational benchmarkHigh-Performance Premium Midrange SoC

What works

  • Cool gaming thermals
  • TSMC 4nm efficiency
  • Imagiq 785 ISP

What does not

  • Uses Armv8 Cortex-A78 rather than Armv9

Our verdict

Summary of the architecture and published performance data for MediaTek Dimensity 8200-Ultra Mobile Platform (MT6896).

Incredible thermal efficiency and battery life on TSMC 4nm. Solid 900K+ AnTuTu performance at an affordable price. High refresh rate 144Hz display support.

Engineered on TSMC 4nm lithography, Dimensity 8200-Ultra features a 1+3+4 CPU cluster with a 3.1GHz Cortex-A78 prime core, Mali-G610 MC6 graphics, and MediaTek APU 580 AI processing.

Best for: Smooth everyday multitasking · Battery-efficient daily browsing · Essential 5G streaming

Smartphones Powered by Dimensity 8200-Ultra

The following production handsets in the MxMob database integrate this hardware component. Click any device to read its complete specification sheet.

Official Reference Documentation & Citations

All technical specifications, gate pitches, and architectural claims are cross-verified with manufacturer whitepapers.

Datasheet

MediaTek Dimensity 8200-Ultra Overview

MediaTek

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Frequently Asked Questions: Dimensity 8200-Ultra

How does Dimensity 8200-Ultra compare to Snapdragon 870?

Dimensity 8200-Ultra outperforms Snapdragon 870 by roughly 15-20% in compute while delivering better battery efficiency on TSMC 4nm.