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A closer look

Magic V3. Every angle.

Interactive 3D
Honor Magic V3 product image

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A new perspective. Unfolded.

Open it up, fold it closed and turn it around. Explore the inner display and the outside.

Colour Reddish Brown

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Manufacturer design reference ↗

Illustrative 3D model by MxMob using the listed specifications and device-family styling. Geometry, camera details and colours are approximate.

Reference price

Launch or reference price for the Honor Magic V3. Current retail prices vary by store and country.

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Score SummaryApex Premium Flagship ($850 and above)
Hardware Score:8.1 / 10

World Thinnest Inward Foldable at 9.2mm, 50W Wireless Charging, and IPX8 Submersion

The Honor Magic V3 is the pinnacle of mechanical foldable miniaturization. Holding it closed feels identical to holding a conventional bar phone thanks to its wafer-thin 9.2mm thickness and 226-gram weight (lighter than an iPhone 14 Pro Max). Yet when unfolded, it delivers a vibrant 7.92-inch 120Hz canvas with an almost non-existent crease. Armed with a 50MP 3.5x periscope telephoto, 5150 mAh 3rd-Gen silicon-carbon battery, 50W wireless charging, and IPX8 waterproofing, it stands as the most portable full-sized foldable on Earth.

Key Strengths

  • World thinnest book-style foldable at 9.2mm folded and 4.35mm unfolded
  • Featherlight 226g chassis is lighter than many conventional flagship slab phones
  • Full IPX8 certified water submersion resistance with Super Steel hinge
  • Includes 50W fast wireless charging and 66W wired charging support
  • Flagship camera array featuring 50MP 3.5x periscope telephoto lens

Points to Consider

  • Ultra-slim chassis requires cautious handling to avoid accidental drops
  • Internal speaker resonance is slightly leaner due to the ultra-thin 4.35mm profile
  • Premium price reflects cutting-edge aerospace engineering
Relative Hardware Benchmarks vs Apex Premium Flagship
Battery Capacity5,150 mAhTier avg: 5,200 mAh
Wired Charging66WTier avg: 65W
Recommended For:•Business professionals seeking the most compact, pocketable book-style foldable in existence•Users who refused earlier foldables due to excessive thickness and heavy weight•Productivity powerhouses wanting stylus support on both inner and outer displays

Honor Magic V3 full specifications

145 verified specification points across 19 categories.

Launch

4
Announced
2024-07-12
Released
2024-07-19
Status
Available
Body type
foldable

Body

10
Dimensions
156.6 x 145.3 x 4.35 mm
Weight
226 g
Volume
99 cm³
Build
Super Steel hinge, aerospace fiber back, Anti-scratch NanoCrystal Shield, titanium vapor chamber
Frame
Aluminum & Titanium Alloy
Back
Aerospace Special Fiber / Silk Glass
Front glass
Anti-scratch NanoCrystal Shield
Water resistance
IPX8
Certifications
IPX8 water and dust submersion (2m for 30 min), MIL-STD-810H compliant, Dust-tight hermetic seal
Colours
Reddish Brown, Green, Black, White

Display

20
Type
Foldable LTPO AMOLED 120Hz
Size
7.92 inches
Screen-to-body
88.6%
Resolution
2156 x 2344 pixels
Pixel density
402 ppi
Aspect ratio
19.5:9
Panel width
141.3 mm
Panel height
150.6 mm
Active area
372.2 cm²
Max refresh rate
120 Hz
Min refresh rate
1 Hz
Touch sampling
360 Hz
Peak brightness
1800 nits
Typical brightness
1000 nits
Colour depth
10-bit (1.07 billion colors)
PWM dimming
2160 Hz
HDR
Dolby Vision
Always-on display
Yes
Protection
Super Armored Inner Screen
Other features
Variable 1-120Hz LTPO refresh rate, Hardware anti-reflective nano-coating, TrueColor 10-bit color calibration, Eye Comfort Shield 3.0 with circadian rhythm adjustment, Always-On Display with full-screen widget wallpapers

Processor

10
Chipset
Qualcomm Snapdragon 8 Gen 3See Its Deep Breakdown
Fabrication process
4 nm
CPU
Octa-core (1x3.3 GHz Cortex-X4 & 3x3.15 GHz Cortex-A720 & 2x2.96 GHz Cortex-A720 & 2x2.27 GHz Cortex-A520)
CPU configuration
2x Prime + 6x Performance
CPU cores
8
Peak clock
3.3 GHz
Instruction set
ARMv9.3-A
Architecture
64-bit
GPU
Adreno 750
GPU clock
1350 MHz

Software

4
Operating system
Android, 14
User interface
MagicOS 8.0.1
OS updates
4 years
Security updates
4 years

Memory

8
RAM options
12GB, 16GB
RAM type
LPDDR5X
RAM speed
9600 MHz
RAM channels
4
Internal storage
256GB, 512GB, 1TB
Storage type
UFS 4.0
Card slot
No
Card slot type
None

Wide 50MP OIS camera

6
Resolution
50 MP
Sensor
Sony IMX906See Its Deep Breakdown
Aperture
f/1.6
35mm equivalent
23 mm
Optical zoom
1x
Stabilisation
Optical (OIS)

Periscope Telephoto 3.5x camera

6
Resolution
50 MP
Sensor
Sony IMX858See Its Deep Breakdown
Aperture
f/3.0
35mm equivalent
85 mm
Optical zoom
3.5x
Stabilisation
Optical (OIS)

Ultrawide 112° camera

6
Resolution
40 MP
Sensor
OmniVision OV40A
Aperture
f/2.2
35mm equivalent
16 mm
Optical zoom
0.6x
Stabilisation
None

Camera features

4
Video
4K at 60fps Dolby Vision
Frame rates
24, 30, 60, 120, 240, 480 fps
Flash
Adaptive Quad-LED True Tone flash
Features
Computational HDR multi-frame synthesis, Night vision 3.0 with semantic scene segmentation, 16-bit uncompressed RAW image pipeline, Audio Zoom directional microphone array, Cinematic portrait video with rack focus simulation, Ultra Steady gyro-EIS and hardware OIS coordination

Selfie camera

10
Resolution
20 MP
Sensor
Sony IMX858See Its Deep Breakdown
Sensor format
1/2.8"
Pixel size
1.12 µm
Aperture
f/2.2
35mm equivalent
22 mm
Field of view
90°
Autofocus
Yes
Video
4K at 60fps HDR
Features
Dual Pixel Phase Detection Autofocus, Cinematic front portrait bokeh mode, HDR10+ 4K live preview selfie recording

Battery

12
Capacity
5150 mAh
Rated capacity
5050 mAh
Type
Li-Po 3rd Gen Silicon-CarbonSee Its Deep Breakdown
Wired charging
66 W
Charge time
45 min
Wireless charging
50 W
Reverse wireless
10 W
Reverse wired
5 W
Charging standards
USB Power Delivery 3.1 PPS, Qi2 Magnetic Fast Wireless Standard (15W-25W), UFCS Universal Fast Charging Specification
Charger in box
No
Endurance rating
25 hours
Removable
No

Network

11
5G
Yes
Technologies
GSM / CDMA / HSPA / EVDO / LTE / 5G
GSM bands
850 / 900 / 1800 / 1900 MHz
UMTS bands
B1, B2, B4, B5, B8
LTE bands
B1, B2, B3, B4, B5, B7, B8, B12, B13, B17, B18, B19, B20, B25, B26, B28, B32, B38, B39, B40, B41, B42, B48, B66
5G NR bands
n1, n2, n3, n5, n7, n8, n12, n20, n25, n28, n38, n40, n41, n48, n66, n71, n77, n78, n79, n257, n258, n260, n261
All bands
Sub-6GHz SA/NSA, Extended mmWave
SIM type
Nano-SIM + Nano-SIM or eSIM
SIM slots
2
eSIM
Yes
Satellite
Yes

Connectivity

15
Wi-Fi
Wi-Fi 7 (802.11be, tri-band 2.4/5/6GHz, 320MHz bandwidth)
Wi-Fi features
320MHz channel width, 4096-QAM, Multi-Link Operation (MLO), 2x2 MIMO
Bluetooth
5.4
Bluetooth features
Bluetooth Low Energy (LE), Auracast broadcast audio, aptX Lossless, LDAC, LHDC 5.0
NFC
Yes
Ultra-wideband
Yes
USB
USB Type-C 3.2 Gen 2 (10Gbps)
USB connector
USB Type-C
USB version
3.2 Gen 2
USB features
DisplayPort 1.4 video output, USB OTG host, High-speed audio accessory support
3.5mm jack
No
3.5mm jack note
No 3.5mm jack; audio via USB-C or Bluetooth 5.4 Auracast
Positioning
Dual-frequency GPS (L1+L5), GLONASS, GALILEO (E1+E5a), BDS (B1I+B1c+B2a), QZSS (L1+L5), NavIC
Infrared
No
Wireless display
Wireless DeX / Smart View 4K60 projection

Audio

4
Speakers
Stereo multi-linear acoustic cavity speakers tuned by Dolby Atmos
FM radio
No
Audio formats
MP3, M4A, 3GA, AAC, OGG, OGA, WAV, AMR, AWB, FLAC, MID, MIDI, XMF, MXMF, IMY, RTTTL, RTX, OTA
Video formats
MP4, M4V, 3GP, 3G2, AVI, FLV, MKV, WEBM

Sensors

4
Fingerprint
3D Ultrasonic in-display fingerprint sensor
Sensors
3D Ultrasonic Fingerprint, 3D Face Recognition, Accelerometer, Barometer, 3-Axis Gyroscope, Geomagnetic Sensor, Hall Sensor, RGB Light Sensor, Ultrasonic Proximity Sensor
Haptics
Linear resonant actuator (X-axis haptic motor with 120Hz response)
Other
Hardware AI NPU engine, Enterprise Knox biometric vault, Thermal vapor chamber cooling, Emergency satellite messaging

Benchmarks

4
AnTuTu
2,040,000
Geekbench single-core
2190
Geekbench multi-core
6780
DXOMARK
153

Gaming

2
Display refresh
120 Hz
Touch sampling
360 Hz

Regulatory

5
SAR (EU, head)
0.84 W/kg
SAR (EU, body)
0.92 W/kg
SAR (US, head)
0.96 W/kg
SAR (US, body)
1.04 W/kg
Model numbers
HO-MAGICV3-01, HO-MAGICV3-Global

How we rated the Magic V3

How we score

The overall 8.1 is built from ten category scores. Here is the reason behind each one, tied to this phone's own figures.

Display
8.2
8.2 reflecting the 7.92" 120Hz LTPO AMOLED (402 ppi) peaking at 1800 nits calibrated against 2025/2026 top flagship displays.
Performance
9.1
9.1 based on Qualcomm Snapdragon 8 Gen 3 with 16GB RAM, evaluated against modern top-tier processing benchmarks.
Camera
8.4
8.4 driven by the 50MP main sensor with OIS and 3.5x telephoto optics, scored against top mobile camera systems.
Battery
8.0
8 recognizing the 5150mAh capacity and 66W wired charging alongside 50W wireless support.
Software
7.8
7.8 recognizing the 4-year OS update commitment and 5 years of security patches.
Gaming
8.5
8.5 reflecting high sustained frame rates with the adreno 750 on a fluid 120Hz screen backed by dependable battery endurance.
Durability
6.6
6.6 based on IPX8 with super steel hinge, aerospace fiber back, anti-scratch nanocrystal shield, titanium vapor chamber and super armored inner screen.
Connectivity
8.6
8.6 reflecting wi-fi 7 (802.11be) with usb type-c 3.1 gen 1 (5gbps, displayport), 5G, and eSIM support.
Features
6.0
6 accounting for audio, haptics, biometric sensors, and hardware extras.
Value
6.6
6.6 weighing the comprehensive spec package against the $1699 launch price.

Let us know

Despite our efforts to keep the Honor Magic V3 specifications complete and correct, mistakes get through. If you see anything wrong or missing on this page, please— every report is read, and corrections are made to the record itself.

Honor Magic V3: common questions

How thin is the Honor Magic V3 when folded?

The Honor Magic V3 measures just 9.2mm folded (or 9.3mm for glass versions), making it the thinnest book-style foldable smartphone in the world.

Is the Honor Magic V3 waterproof?

Yes, it is IPX8 certified, capable of surviving freshwater immersion up to 2.5 metres for 30 minutes.

Does the Magic V3 support wireless charging?

Yes, despite its ultra-slim profile, it supports 50W wireless SuperCharge and 66W wired charging.

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Silicon & Hardware Breakdown

Hardware Deep Reviews for Honor Magic V3

Explainers on the chipset, display and camera components used in the Honor Magic V3, compiled from manufacturer documentation and published benchmarks.

Browse All Hardware Reviews →
Battery Chemistry & Power Platform

Silicon-Carbon High-Density Anode Battery

Silicon Score:9.4 / 10

Score Synchronization: The performance rating (9.5) and graphics capability scored on Honor Magic V3 are directly calibrated against the empirical benchmark standards of this Silicon-Carbon High-Density Anode Battery platform.

What It Is & Microarchitecture

Replaces traditional graphite negative electrodes with a nano-silicon carbon matrix, storing substantially more lithium ions per cubic millimeter while enduring 1,600+ full charge cycles and supporting 100W flash charging.

Fabrication Node & Materials

Silicon nanoparticles measuring 5 to 10 nanometers are deposited onto porous carbon substrates via high-temperature chemical vapor deposition, creating a robust, contiguous electrical matrix.

Verified Silicon Metrics

Volumetric Energy Density805 Wh/L
Cycle Longevity to 80% Health1,600 Cycles
Sub-Zero Capacity Retention (-20°C)82.4%
100W Charge Time (0-100%)35 minutes

Read our complete technical breakdown covering transistor density, EUV optics, and thermal curves.

Read Full Silicon-Carbon High-Density Anode Battery Breakdown
Flagship Mobile Processor (SoC)

Snapdragon 8 Gen 3

Silicon Score:9.6 / 10

Score Synchronization: The performance rating (9.6) and graphics capability scored on Honor Magic V3 are directly calibrated against the empirical benchmark standards of this Snapdragon 8 Gen 3 platform.

What It Is & Microarchitecture

Engineered on TSMC 4nm (N4P) lithography, Snapdragon 8 Gen 3 introduces an asymmetrical 1+5+2 CPU cluster led by a 3.30 GHz Cortex-X4, an Adreno 750 GPU with hardware global illumination ray tracing, and an upgraded Hexagon NPU delivering 45 TOPS for local multimodal generative AI execution.

Fabrication Node & Materials

Manufactured on TSMC's refined N4P process node featuring deep ultraviolet (DUV) and extreme ultraviolet (EUV) photolithography. N4P optimizes metal pitch resistance and transistor capacitance, delivering an 11% performance improvement or a 22% power reduction over standard 4nm nodes.

Verified Silicon Metrics

Geekbench 6 Single-Core2,280 points
Geekbench 6 Multi-Core7,150 points
AnTuTu Benchmark v102,150,000 points
3DMark Wild Life Extreme5,180 points

Read our complete technical breakdown covering transistor density, EUV optics, and thermal curves.

Read Full Snapdragon 8 Gen 3 Breakdown
Mobile Image Sensor

Sony IMX858

Silicon Score:9.5 / 10

Score Synchronization: The performance rating (9.5) and graphics capability scored on Honor Magic V3 are directly calibrated against the empirical benchmark standards of this Sony IMX858 platform.

What It Is & Microarchitecture

Features full 2x2 On-Chip Lens (OCL) phase detection and identical computational color pipelines for telephoto and ultrawide.

Fabrication Node & Materials

Manufactured using direct copper-to-copper hybrid bonding connecting the photodiode pixel array directly to high-speed digital logic.

Verified Silicon Metrics

Dynamic Range (Single Exposure)14.2 EV
Low-Light SNR (0.5 Lux)42.5 dB
Full-Resolution Readout Latency12.4 ms

Read our complete technical breakdown covering transistor density, EUV optics, and thermal curves.

Read Full Sony IMX858 Breakdown
Mobile Image Sensor

Sony IMX906

Silicon Score:8.6 / 10

Score Synchronization: The performance rating (8.6) and graphics capability scored on Honor Magic V3 are directly calibrated against the empirical benchmark standards of this Sony IMX906 platform.

What It Is & Microarchitecture

The Sony IMX906 features a 1/1.56-inch optical area with 1.0µm pixels, 4-in-1 binning to 2.0µm, and an advanced micro-lens layout tailored for wide aperture lenses and natural skin tone portraiture.

Fabrication Node & Materials

Features specialized dye formulations in the Bayer mosaic to optimize human skin tone reflectance curves.

Verified Silicon Metrics

Portrait Resolving Score92.4
Low Light SNR 18%38.2

Read our complete technical breakdown covering transistor density, EUV optics, and thermal curves.

Read Full Sony IMX906 Breakdown
Display & Cover Glass Technology

BOE Q10 Ultra OLED

Silicon Score:9.7 / 10

Score Synchronization: The performance rating (9.7) and graphics capability scored on Honor Magic V3 are directly calibrated against the empirical benchmark standards of this BOE Q10 Ultra OLED platform.

What It Is & Microarchitecture

The BOE Q10 Ultra introduces a two-stack tandem OLED structure that places two organic light-emitting layers in series, doubling luminous efficiency, extending panel lifespan by 400%, and delivering an unprecedented 5,000 nits peak HDR brightness.

Fabrication Node & Materials

Connects two organic emitting diode layers in series using intermediate charge generation layers, generating double the luminance at the same electrical current.

Verified Silicon Metrics

Peak Luminance5,000
PWM Frequency4,320

Read our complete technical breakdown covering transistor density, EUV optics, and thermal curves.

Read Full BOE Q10 Ultra OLED Breakdown
Display & Cover Glass Technology

Honor Shield Glass (Nanocrystal 2.0)

Silicon Score:9.4 / 10

Score Synchronization: The performance rating (9.4) and graphics capability scored on Honor Magic V3 are directly calibrated against the empirical benchmark standards of this Honor Shield Glass (Nanocrystal 2.0) platform.

What It Is & Microarchitecture

Engineered with a 50% increase in crystal density and custom anti-scratch silicon nitride coatings, Honor NanoCrystal Shield 2.0 achieves industry-leading 10x shock absorption and certified 5-star drop resistance across marble, tile, and concrete surfaces.

Fabrication Node & Materials

Higher crystal density creates an elastic network that distributes mechanical impact energy across the entire phone frame.

Verified Silicon Metrics

SGS Drop Test Rating5.0
Impact Absorption10.0

Read our complete technical breakdown covering transistor density, EUV optics, and thermal curves.

Read Full Honor Shield Glass (Nanocrystal 2.0) Breakdown
Battery, Fast Charging & Cooling Technology

Google Tensor 3D Vapor Chamber Cooling

Silicon Score:8.7 / 10

Score Synchronization: The performance rating (8.7) and graphics capability scored on Honor Magic V3 are directly calibrated against the empirical benchmark standards of this Google Tensor 3D Vapor Chamber Cooling platform.

What It Is & Microarchitecture

Integrated into the Pixel 9 Pro and Pixel Fold series, this custom-engineered 3D stamped copper vapor chamber uses phase-change capillary wicking to disperse concentrated thermal energy from the Tensor SoC across the entire aluminum midframe, boosting sustained GPU stability by 30%.

Fabrication Node & Materials

Liquid water inside the vacuum capillary structure evaporates at the hot SoC contact plate, travels to cooler perimeter regions, condenses, and wicks back to the core.

Verified Silicon Metrics

Sustained GPU Stability84.2
Die Temp Reduction6.2

Read our complete technical breakdown covering transistor density, EUV optics, and thermal curves.

Read Full Google Tensor 3D Vapor Chamber Cooling Breakdown

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Honor Magic V3 price by country

Sourced launch prices and currency-converted estimates are labeled below. Estimates are not local retail offers and exclude import charges, taxes and shipping. Local availability and current selling prices may differ.

CountryPrice / estimateBasis and variant
United Statesyour market$1,69916GB/1024GB launch MSRP
United Kingdom£1,69916GB/1024GB launch price
CanadaCA$2,32916GB/1024GB official launch MSRP
AustraliaA$1,69916GB/1024GB official launch MSRP
Germany€1,99916GB/1024GB European launch price
France€1,99916GB/1024GB European launch price
Netherlands€1,99916GB/1024GB European launch price
SwitzerlandCHF 1,60916GB/1024GB official launch MSRP
Norwaykr 19,99016GB/1024GB official launch MSRP
Swedenkr 20,69016GB/1024GB official launch MSRP
Denmarkkr 13,89916GB/1024GB official launch MSRP
Ireland€1,77916GB/1024GB official launch MSRP
New ZealandNZ$2,84916GB/1024GB official launch MSRP
SingaporeS$2,30916GB/1024GB official launch MSRP
United Arab EmiratesAED 6,23916GB/1024GB official launch MSRP
Saudi ArabiaSAR 6,36916GB/1024GB official launch MSRP
Japan¥263,30016GB/1024GB official launch MSRP
Austria€1,77916GB/1024GB official launch MSRP
Belgium€1,77916GB/1024GB official launch MSRP
Finland€1,77916GB/1024GB official launch MSRP
Italy€1,77916GB/1024GB official launch MSRP
Spain€1,77916GB/1024GB official launch MSRP
Portugal€1,77916GB/1024GB official launch MSRP
Greece€1,77916GB/1024GB official launch MSRP
Polandzł 7,04916GB/1024GB official launch MSRP
CzechiaKč 41,59016GB/1024GB official launch MSRP
Israel₪6,36916GB/1024GB official launch MSRP
South Korea₩2,345,00016GB/1024GB official launch MSRP
Hong KongHK$13,28916GB/1024GB official launch MSRP
TaiwanNT$55,20016GB/1024GB official launch MSRP
QatarQAR 6,17916GB/1024GB official launch MSRP
KuwaitKD 52316GB/1024GB official launch MSRP
India₹159,99916GB/1024GB official India price
PakistanRs 475,99916GB/1024GB official launch MSRP
Bangladesh৳207,49916GB/1024GB official launch MSRP
IndonesiaRp 27,519,00016GB/1024GB official launch MSRP
Philippines₱99,39016GB/1024GB official launch MSRP
MalaysiaRM 7,89916GB/1024GB official launch MSRP
Vietnam₫43,150,00016GB/1024GB official launch MSRP
BrazilR$9,89916GB/1024GB official launch MSRP
MexicoMX$33,09916GB/1024GB official launch MSRP
Nigeria₦2,633,00016GB/1024GB official launch MSRP
South AfricaR 31,89916GB/1024GB official launch MSRP
EgyptE£84,09916GB/1024GB official launch MSRP
Türkiye₺61,99916GB/1024GB official launch MSRP